CSP
Production Information
Features
- Package Size: 3 x 3mm up to 19 x 19 mm
- Thickness: 0.10mm - 0.36mm
- Ball Pitch: 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm
- Line & Space down to 12/16 um
- RoHS compliance materials
- Layer count from 2 layer up to HDI 6 layers
- Structure: single die, multiple die, POP, Embeded Active Die
- Designed for strict reliability test including Drop Test
Benefits
- Small scale and light weight
- Lowe inductance, low capacitance and enhanced electrical performance
Applications
- Biometrics
- MEMs
- CMOS Image Sensor
- Power Management
- MCU/ECU