FCCSP
Production Information
Features
- Package Size: 3 x 3 mm up to 15 x 15 mm
- Line & Space 12/16um
- Bump Pitch down to 130um
- Impedance control for critical signal traces
- Structure range from 2 layers to 14 layers
- For products demanding high density and reliability
- For small package size with high electric performance product
Benefits
- High I/O Count and Short Interconnects
- High layout density
- Cost reduction due to smaller package size
Applications
- Portable Smart Devices e.g. Smartphone
- Consumer Electronics
- 5G application